摘要
Co68.15Fe4.35Si12.25B15.25 （at%） amorphous microwires with a smooth surface and a circular cross-section were fabricated by the glass-coated melt spinning method. Their mechanical properties were evaluated through tensile tests of the glass-coated amorphous mi-crowires, and their fracture reliability was estimated using two-and three-parameter Weibull analysis. X-ray diffraction and transmission electron microscopy results showed that these glass-coated Co-based microwires were mostly amorphous. The coated Co-based microwires exhibit a tensile strength of 1145 to 2457 MPa, with a mean value of 1727 MPa and a variance of 445 MPa. Weibull statistical analysis showed that the tensile two-parameter Weibull modulus of the amorphous microwires is 4.16 and the three-parameter Weibull modulus is 1.61 with a threshold value as high as 942 MPa. These results indicate that the fabricated microwires exhibit good tensile properties and fracture reliability, and thus appear to be good candidates for electronics reliability engineering applications.
Co68.15Fe4.35Si12.25B15.25 （at%） amorphous microwires with a smooth surface and a circular cross-section were fabricated by the glass-coated melt spinning method. Their mechanical properties were evaluated through tensile tests of the glass-coated amorphous mi-crowires, and their fracture reliability was estimated using two-and three-parameter Weibull analysis. X-ray diffraction and transmission electron microscopy results showed that these glass-coated Co-based microwires were mostly amorphous. The coated Co-based microwires exhibit a tensile strength of 1145 to 2457 MPa, with a mean value of 1727 MPa and a variance of 445 MPa. Weibull statistical analysis showed that the tensile two-parameter Weibull modulus of the amorphous microwires is 4.16 and the three-parameter Weibull modulus is 1.61 with a threshold value as high as 942 MPa. These results indicate that the fabricated microwires exhibit good tensile properties and fracture reliability, and thus appear to be good candidates for electronics reliability engineering applications.
基金
financially supported by the National Natural Science Foundation of China(No.51371067)
supported by the Japan Society for the Promotion of Science(JSPS) fellowship and Grants-in-Aid for Scientific Research(No.25-03205)
