摘要
介绍了 BMC用于微电机模压塑封研制。重点讨论了研制中主要问题 ,开裂、光洁度等的分析解决。
The development of BMC of molding compounds for encapsulating micrometer is introduced in this paper .It is emphasised to discuss about toughening methods ,cracks and their eliminating methods, surfacefinish, fire retardance in the process of development of BMC pasts. Analyses and Solving methods about these problems presented in the paper.
