摘要
介绍了IGBT模块的封装工艺,分析真空回流焊接过程中焊料层空洞的形成机理,并使用SAM方法检测并测量空洞;接着通过有限元模拟方法对模块进行热分析,对比了焊料层有、无空洞情况下模块的整体温度,具体研究焊料层空洞尺寸、空洞分布位置和焊料层厚度对芯片温度分布的影响。
The packaging process of IGBT module is introduced,the formation mechanism of the solder void is analyzed,and SAM（ Scanning Acoustic Microscope） method is used to detect and measure the voids. Besides,FEA（ Finite Element Analysis） method is chosen to analyze the thermal performance of IGBT module. Commercial finite element software is used to compare the temperature distribution of module with and without solder void. Moreover,the relationship between void size,void location,solder thickness and thermal performance of chip are studied.
出处
《中国电子科学研究院学报》
2014年第2期125-129,共5页
Journal of China Academy of Electronics and Information Technology
基金
国家863高技术基金项目(2011AA050401)
