摘要
PCB电镀镍金生产过程中有时会发生金面变色的问题,金是稳定的金属元素,理论上金的氧化并非自发,分析认为出现三种情况会导致金面变色。本篇将从导致变色的生产流程重要环节上加以探讨分析。
ENIG is widely used ill PCB surface treatment process. Discoloration problem usually appears in gold surface of ENIG. Gold is a stable element, theoretically the oxidation will not happen spontaneously. This paper analyzes 3 factors which cause the gold discoloration. This paper studies on the key production process steps to analyze the causes of discoloration.
出处
《印制电路信息》
2014年第5期48-51,共4页
Printed Circuit Information
关键词
电镀镍金板
金面变色
Nickel Plating Panels
Discoloration of Gold Surface
