期刊文献+

相控阵雷达子阵的热设计 被引量:5

The Thermal Design of the Array Radar Sbstructure
在线阅读 下载PDF
导出
摘要 针对相控阵雷达子阵系统不同的结构方案,应用热设计仿真软件建立了系列热仿真模型。依据冷板类型、冷板安装位置、功能层类型,将系列模型分为3组,并给出了3组模型的温度剖视图和温度全图。通过对热仿真结果的对比分析,选择了能较好满足子阵热设计总体要求的结构方案。分析总结了带液冷冷板子阵系统的散热规律,为今后高功率密度和大功率器件的散热提供参考。 In view of the different structure schemes on the array radar substructure , it establishes a series of sim-ulation models similar to the schemes in the application of the thermal simulation software CFD .On the basis of cold plate type , cold plate installation position and function layer type , it divides the series models into three groups , then obtains the simulation images of the three groups respectively .Through the comparison and analysis of thermal simulation results , it shows the structure scheme which better meets the general requirements of ther-mal design on substructure .It analyzes and summarizes the heat dissipation of substructure with cold plate , pro-vides the guidelines for the heat dissipation of high power density and high power devices .
作者 弋辉
出处 《机械设计与制造工程》 2014年第4期17-20,共4页 Machine Design and Manufacturing Engineering
关键词 热设计 雷达子阵 冷板 CFD分析 Thermal Design Substructure of Radar Cold Plate CFD Analysis
  • 相关文献

参考文献6

二级参考文献32

  • 1陈洁茹,朱敏波,齐颖.Icepak在电子设备热设计中的应用[J].电子机械工程,2005,21(1):14-16. 被引量:76
  • 2Li Geng,Chen Zhi-ming, Kruemmer R. A Precise Model for Simulation of Temperature Distribution in Power Modules[J]. Chinese of Journal of Semiconductors, 2001,22 (5) : 548-553.
  • 3Mark S Hauhe, John J Wooldrige. High density packaging of X - band active array modules[J]. IEEE Transactions on Components, Packaging, and Manufacturing Techno - logy (Part B), 1997,20(3) :279- 291.
  • 4Odile Adrian. From AESA radar to digital radar for surface- based apphcatiorts [ C]//Proceedings of IEEE Radar Conference. Pasadena, CA: IEEE, 2008 : 1 - 5.
  • 5Al- Dahleh R, Mansour R R. A novel vialess vertical integration method for MEMS scanned phased array modules [ C]//Proceedings of European Microwave Conference. Amsterdam: [s. n. ] ,2008:96 - 99.
  • 6Puzella A, Aim R. Air- cooled, active transmit/receive panel array[ C]//Proceedings of IEEE Radar Conference. Rome : IEEE, 2007 : 421 - 426.
  • 7Ananth Sundaram, Maddela M, Ramadoss R, et al. MEMS - Based Electronically Steerable Antenrm Array Fabricated Using PCB Technology [ J ]. Journal of Microelectromechanical Systems, 2008,17(2):356- 362.
  • 8Taeksoo Ji, Yoon H, Abraham J K, et al. Ku- band antenna array feed distribution network with ferroelectric phase shifters on silicon[J]. IEEE Transactions on MTT, 2006,54 (3): 1131 - 1138.
  • 9Mancuso Y, Gremillet P, Lacomme P, et al. T/R - modules technological and technical trends for phased array antennas [C]//Proceedings of European Microwave Conference. [ S. l. ] :IEEE,2005:817 - 820.
  • 10Comeau J P, Morton M A, Kuo W - M L, et al. A silicongermanium ceceiver for X- Band transmit/receive radar modules[J]. IEEE Journal of Solid - State Circuits, 2008,43 (9) : 1889 - 1896.

共引文献111

同被引文献28

引证文献5

二级引证文献8

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部