摘要
背板作为印制电路板的一种,因其结构特性、应用领域等,挑战常规印制电路板多项加工技术。本文浅谈背板加工流程之压合层间对准度、钻孔背钻、孔金属化深镀能力及最终表面工艺方面的技术及控制项,供同行参考与借鉴。
As a kind of printed circuit boards, backplane had unique structures and special application areas, so it challenged to the manufacturing technologies of normal printed circuit boards. This article made a review of backplane manufacturing technologies and control, including lamination registration, backdrilling, plating through hole power and surface ifnish. It could give references and suggestions to the printed circuit board industry.
出处
《印制电路信息》
2014年第4期169-174,共6页
Printed Circuit Information
关键词
背板
层间对准度
背钻
深镀能力
Backplane
Lamination Registration
Back Drilling
Through Power
