摘要
结合当今的电子产品发展方向,探索出一款12层,集合3阶HDI、高频板材、刚挠结合三种特性于一身的印制板的制作技术难点,并就问题点提出改善方法。
Considering the development of electronic products, this paper explored the PCB production technical dififculties of a 12 layer, with three kinds of characteristics 3＋N＋3 structure of HDI, high frequency, rigid-Flex, and the improvement method of problem is proposed.
出处
《印制电路信息》
2014年第3期30-33,49,共5页
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