摘要
用计算机控制的激光融刻装置对几百埃厚的Gd_1Ba_2Cu_3O_(7-δ)超导薄膜和二百微米左右厚的Y_1Ba_2Cu_3O_(7-δ)超导片进行不同尺寸微桥的融刻加工试验,并用扫描电镜、扫描俄歇电子谱,α-step仪以及R-T测量装置对新加工的微桥进行形貌观察、测量,成份剖面分析以及相应的超导电性测量。对所得的实验结果进行了讨论。
Micro-bridges of the different sizes on Gd_1Ba_2Cu_3O_(7-δ)superconducting thim film and Y_1Ba_2Cu_3O_(7-δ)superconducting wafer, thickness about a few hundreds Angstrom, 200μ respectively, were written by computer contrlled laser ablation, process micro-bridges were studied by using a Scanning Elcctron Microscope (SEM), Scanning Auger Microprobe (SAM), α-step profile meter and R-T measurements, experimental results were discussed.
出处
《光电子．激光》
EI
CAS
CSCD
北大核心
1991年第1期8-12,共5页
Journal of Optoelectronics·Laser
