期刊文献+

Cu_4簇合物“元件组装”合成及其结构与电催化作用

Component Assembly Synthesis, Structure and Electro-Catalysis of Cu_4 Cluster Compound
在线阅读 下载PDF
导出
摘要 以元件组装方法合成了Cu4(HL)4·2H2O簇合物(H2L=N-乙氧羰基-N′-o-硝基苯基硫脲)。用X射线单晶衍射技术、核磁共振谱、红外光谱和元素分析等确定了簇合物及其相应组装元件的晶体结构和化学组成,并对簇合物的电催化性质进行了检测。结果表明,该簇合物由4个Cu(I)以M-M键构成簇核,4个硫脲配体分别以硫羰基硫原子和氮原子配位于Cu(I)构成簇合物配位结构,DPV分析显示该簇合物对O2具有较高催化活性。 A Cu4 cluster compound, Cu4(HL)4·2H2O, (H2L=N-ethoxycarbonyl-N'-o-nitrophenylthiourea), was synthesized in the way of component assembly. Structures and chemical compositions of the cluster compound and its corresponding component were determined by single crystal X-ray diffraction analysis, elemental analysis, FTIR, 1H NMR etc., and its electro-catalysis was also characterized. The experimental results show that the core of the cluster compound is composed by four Cu(I) linked with M-M bonds, and the Cu(I) are coordinated by 4 thiourea ligands with thiocarbonyl sulfur atom and nitrogen atom, respectively. DPV Electro-catalysis shows that the cluster compound is of high O2 catalysis activation. CCDC: 945182, Cu(H2L)2Cl·H2O; 602859, Cu4(HL)4·2H2O.
出处 《无机化学学报》 SCIE CAS CSCD 北大核心 2014年第3期557-562,共6页 Chinese Journal of Inorganic Chemistry
基金 甘肃省自然科学基金(No.096RJZA087) 中央高校基本科研业务费专项资金(No.ZYZ2012066) 西北民族大学国家大学生创新创业训练计划(201310742005)资助项目
关键词 元件组装 簇合物 硫脲 电催化 component assembly cluster compound thiourea electro-catalysis
  • 相关文献

参考文献19

二级参考文献31

  • 1林奇,张有明,魏太保,高黎明.2,5-二乙氧甲酰氨基-1,3,4-噻二唑超分子化合物的合成和晶体结构[J].有机化学,2005,25(3):290-294. 被引量:21
  • 2苏海全,吴秉芳,王丁泽.具有磷、氯桥基的三核钌羰基簇合物的合成和晶体结构[J].无机化学学报,2005,21(11):1727-1729. 被引量:2
  • 3XU Hong-Wu, CHEN Zhong-Ning, Ishizaka S., Kitamura N., WU Ji-Gui Chem. Commun., 2002, 17, 1934.
  • 4Yam V. W. W., Cheng E. C. C., Cheung K.K. Angew.Chem. Int. Ed. Engl., 1999,38, 197.
  • 5Yam V. W. W., Lam C. H., Fung W. K. M., Cheung K. K.Inorg. Chem., 2000, 40, 3435.
  • 6Cotton F. A., Hong B. Prog. Inorg. Chem., 1992,40, 179.
  • 7Blake A.J., Kathirgamanathan P., Toohey M.J. Inorg.Chim. Acta, 2000, 303, 137.
  • 8Airoldi C., De Oliveira S. F., Ruggiero S. G., Lechat J. R.Inorg. Chim. Acta, 1990, 174, 103.
  • 9Ebihara M., Tokoro K., Maeda M., Ogami M., Imaeda K.,Sakurai K., Masuda H., Kawamura T. J. Chem. Soc.,Dalton Trans, 1994, 3621.
  • 10Romero A. M., Salas J. M., Quiros M., Sanchez M. P.,Molina J., Bahraoui J. E., Faure R. J. Mol. Struct., 1995,354, 189.

共引文献11

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部