摘要
对电子设备在制造过程中常采用的环境应力筛选试验进行研究,对环境应力筛选中常规筛选和定量筛选进行了比较;阐述了电子设备电装之后需施加定量振动应力,以剔除焊接、装配中的虚焊、松动等缺陷的应用,以及需根据设备特点施加定量电应力,以剔除元器件早期失效的应用;根据国军标中筛选应力的描述,对温度和振动应力进行分析;研究表明,温度循环筛选在故障率方面是恒定高温筛选的16.9倍;随机振动在故障率方面是正弦振动的4.8倍;对产品施加电应力能够起到剔除元器件早期失效的作用,覆盖率建议达到90%以上。
An environmental stress screening process generally adopted during the manufacturing process of electronic equipments is re- searched, and traditional screening and quantitative screening among the environmental stress screening are compared. It states that the quantitative vibration stress should be applied after the electronic assembly, so as to eliminate the defects of the jointing and assembly process, such as, rosin joint, loosen and so on, and that quantitative electrical stress should be applied according to characteristic of equip ment so as to eliminate early failure of component. According to the specifications of national standard and military standard, the temperature and vibration stress are analyzed. As can be seen from the result of the research, temperature circulation is 16. 9 times better than constant -high temperature in terms of failure rate, and random vibration is 4. 8 times better than sinusoidal vibration in terms of failure rate, and the application of electrical stress on product could make function of eliminating early failure of component, it is suggested that coverage rate is up to 90 percent.
出处
《计算机测量与控制》
北大核心
2014年第2期456-459,共4页
Computer Measurement &Control
关键词
环境应力筛选
温度循环
随机振动
电应力
电子设备
environmental stress screening
temperature circulation
random vibration
electrical stress
electronic equipments
