摘要
简单介绍了填充型导热复合材料的导热机理,并详细阐述了填充型导热聚酰胺复合材料,从绝缘和非绝缘两个方面概述了国内外学者对导热聚酰胺复合材料的研究进展。最后,对导热塑料今后的发展方向提出了一些想法和展望。
The mechanism of filled thermal conductivity of composite materials was briefly introduced, and the filled thermal conductive polyamide composites were expounded in detail. The research progress on thermal conductive polyamide composites at home and abroad from the two aspects of insulation and non-insulation was reviewed. Finally, the future development trend of thermal conductive plastic was prospected.
出处
《塑料科技》
CAS
北大核心
2014年第3期135-139,共5页
Plastics Science and Technology
关键词
导热机理
填充改性
聚酰胺复合材料
Conduction mechanism
Filling modification
Polyamide composites
