摘要
采用氨基磺酸镍为主盐,研究了不同氯化镍浓度对厚镍镀层的表面形貌、晶粒取向及大小的影响,并测试了镀层标准样的屈服强度、抗拉强度及硬度等力学性能。结果表明:镀层的晶粒均表现出很强的(200)面择优取向。当氯化镍浓度为0.06 mol/L时,镀层(200)面的晶粒最小,为29.6 nm,此浓度下制备的镀层的抗拉强度和屈服强度最高,分别为849 MPa和298 MPa,硬度为2.177 GPa。
The effects of nickel chloride concentration on surface morphology, grain orientation and size of the Ni thick films electroplated from a nickel sulfamate bath were studied. Then the tensile strength and hardness of the normative deposits were tested. The results show that the grains of the Ni platings present obviously preferential orientation along the （200） family plane. The film with the smallest grains size of 29.6 nmin （200）family plane can be obtained from the 0.06 mol/L nickel chloride solution. The tensile strength, yield strength and hardness of the coating are all the highest, which are 849 MPa, 298 MPa and 2.177GPa, respectively.
出处
《热加工工艺》
CSCD
北大核心
2014年第4期123-125,129,共4页
Hot Working Technology
基金
国家自然科学基金资助项目(51072165)
关键词
电镀
氯化镍
晶粒大小
晶粒取向
力学性能
electroplating
nickel chloride
grain size
grain orientation
mechanical property
