摘要
随着近十几年来银价的飙升,镀银类导电粉体填料作为较低成本的替代产品越来越受相关行业(尤其是消费电子类)的关注。对目前较为热点的镀银类导电粉体进行应用和技术现状的总结,并初步展望了此类产品的未来发展趋势。
As the silver prices soared up dramatically in the past decade, Ag-plated conductive fillers drew more and more attention from relevant industries （particularly consumer electronics） as a cheaper alternative. The applications and synthesis technology of some popular Ag-plated conducnve fillers were summaried, and also provided a preliminary prospect of future development trends of these products.
出处
《化工新型材料》
CAS
CSCD
北大核心
2014年第1期164-165,178,共3页
New Chemical Materials
关键词
镀银类导电粉体
消费电子
底材
包覆
Ag-plated conductive filler, consumer electronics, substrate, encapsulation
