摘要
为了提高聚酰亚胺材料(PI)在复杂工程环境下的可靠性,实验研究了真空电子辐射下PI的直流沿面闪络特性,并采用热刺激电流(TSC)法测试辐射前后试样的陷阱参数。结果表明,当辐射电子能量在0.5～20 keV范围内时,试样表面的闪络电压高于无辐射情况下的闪络电压;电子能量越高,介质表面正电荷密度和相对介电常数越小,陷阱深度增大,表面电场均衡性有所提高,因此闪络电压越高;在辐射电子能量不变情况下,束流密度越大,初始电子数越多,泄漏电流越大,则闪络电压越低。
In order to enhance the reliability of polyimide （PI） in complex engineering environments, we obtained the characteristics of surface flashover on polyimide under DC voltage in vacuum during electron beam irradiation through experiments. Besides, trap parameters of the tested samples before and after radiation were also measured using the ther mally stimulated current （TSC） method. The results show that, the surface flashover voltage of sample under the radiation with electron energy of 0.520 keV is higher than that under no radiation. Higher electron energy leads to smaller positive charge density on dielectric surface and smaller relative dielectric constant, as well as larger trap, and consequently im proves the uniformity of surface electric field and increases the flashover voltage. If the radiation electron energy remains the same, the flashover voltage would become lower with increasing beam density, number of initial electrons and leakage current.
出处
《高电压技术》
EI
CAS
CSCD
北大核心
2014年第1期117-123,共7页
High Voltage Engineering
关键词
电子辐射
沿面闪络
电子能量
束流密度
降解
陷阱
electron irradiation
surface flashover
electron energy
beam density
degradation
trap
