摘要
采用新开发出的一种多层片式陶瓷电容器(MLCC)生坯研磨工艺,对现有MLCC加工流程再造,解决现有烧成后芯片研磨工艺对芯片造成内部损伤,导致MLCC芯片内部分层,保护层开裂及芯片棱角崩瓷等影响产品质量的问题,同时对MLCC的加工过程进行简化,缩短加工周期。
New tumbling technique for MLCC green chips will help a lot on re-manufacturing the current MLCC processes,and solve problems affecting product quality, such as delamination inside the chips and cracks of the cover layer caused by the internal damage to fred chips after the tumbling process, and chipped out corners etc. The new tumbling techniques can simplify MLCC manufacturing processes, and shorten the processing cycle.
出处
《电子工艺技术》
2013年第6期367-370,共4页
Electronics Process Technology
基金
国家国际科技合作项目(项目编号:2010DFB33920)
关键词
多层陶瓷电容器(MLCC)
生坯
研磨
分层
MLCC （Multi-layer Chip Ceramic Capacitor）
Green chip
Tumbling
Delamination
