摘要
摘要：针对国内目前sic／A1在产业化中存在的诸多问题，选用W20和w60的β-SiC粉体，采用模压成型制备SiC预制体，并通过底部真空负压浸渗工艺制备了致密度为96％～98％、体积分数为55％～72％的β-SiCp/Al复合材料。XRD、SEM、CT和CTE测试分析表明：所制备的复合材料中存在MgAl20。尖晶石相，没有发现Al4C3脆性相；复合材料组织均匀，存在少量浸渗缺陷，孔洞较少；SiC体积分数为72％的复合材料在常温热度下的热膨胀系数为6．91×10-6／K，热导率为164．8W／（m·K），而sic体积分数为65％的复合材料的热膨胀系数为7．31×10-6／K，热导率为172．7W／（m．K）。
According to the problems existing in the industrialization of SiCp/Al in domestic currently, SiC preforms were prepared by compression molding with W20 and W60 B-SiC powders, respectively. The SiCp/Al composites with relative density of 96%-98% and volume fraction of 55%-72% were fabricated bybottom-vacuum negative pressure infiltration. The results of XRD, SEM, CT and CTE analysis indicate that Mgml204 spinel phase exists in the composites, but Al4C3 brittle phase is not clearly observed. Furthermore, the composites have homogeneous microstructure with fewer defects. The coefficient of thermal expansion with volume fraction of 72% SiC can reach 6.91 × 10^-6K-1 and the thermal conductivity is 164.8 W/（m. K） at the normal temperature, while the coefficient of thermal expansion of those with volume fraction of 65% SiC is 7.31 × 1 0^-6K-1 and the thermal conductivity is 172.7 W/（m-K）.
出处
《铸造》
CAS
CSCD
北大核心
2013年第10期953-957,共5页
Foundry
基金
国家自然科学基金资助项目(51074123)
陕西省科学技术研究发展计划项目(2010TG-02)
西安科技大学博士培育基金项目(2012QDJ034)
关键词
无压浸渗
β-SiCp
AL复合材料
热膨胀系数
热导率
pressureless infiltration
[3-SiCP/A1 composites
coefficient of thermal expansion
thermalconductivity
