摘要
以双酚A型环氧树脂E-44为粘接相，以QNP1（端叔胺基超支化聚酯复合物）为潜伏性固化剂，采用非等温示差扫描量热法（DSC）研究了E-44／QNP1体系的固化行为，以55％银粉为导电填料，研究了固化反应时间对导电浆料电性能的影响。E-44／QNP1体系在25～200℃范围内的固化反应热力学研究结果表明，固化剂QNP1的最佳用量为25％，并根据Kissinger和Crane方程拟合出固化反应动力学方程；在110℃／20min最优固化条件下制备的E-44／QNP1导电银浆，其固化膜的电阻率最小，为3．5×10^-5Ω·cm，可以满足硅异质结太阳能电池顶部电网电极银浆的应用要求。
The curing behavior of E-44/QNP1 system was studied with bisphenol-A epoxy resin E-44 as binder and QNP1, a composite mainly consisting of tertiary amino- terminated hyperbranched polyester, as latent curing agent by non-isothermal differential scanning calorimetry （DSC） method. The influence of curing reaction time on electrical property of a conductive paste containing 55% silver powders as conductive filler was examined. The results of thermodynamic study on the curing reaction of E-44/QNP1 system in temperature range of 25-200 ℃ indicated that the optimal content of curing agent QNP1 is 25%. The kinetic equation was fitted based on Kissinger and Crane equations. The resistivity of the cured film of E-44/QNP1 conductive silver paste obtained under the optimal curing conditions （namely at 110 ℃ for 20 min） is minimum, 3.5 × 10^-5 Ω·cm, meeting the application requirement of top-grid electrode of silicon hetero-junction solar cells.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2013年第9期70-74,共5页
Electroplating & Finishing
基金
湖南省科技重大专项(2009FJ1002-3)
关键词
导电银浆
双酚A型环氧树脂
固化反应动力学
电阻率
太阳能电池
示差扫描量热法
conductive silver paste
bisphenol-A epoxyresin
curing reaction kinetics
resistivity
solar cell
differential scanning calorimetry
