期刊文献+

NiTi合金薄膜生长初期的实验研究

Experimental study of NiTi alloy thin film at the initial stage of growth
在线阅读 下载PDF
导出
摘要 针对制备NiTi合金薄膜中原子个数比难于控制的问题,探讨了一种工艺方法制备薄膜.该工艺运用射频磁控溅射法,采用倾斜的固定的纯Ni和纯Ti的单质靶材同时溅射,同时基底自转的方法,以保证整个薄膜在制备过程中Ni原子、Ti原子在基底上均匀分布,并可以很好的控制各原子的溅射功率.研究不同基底温度和不同溅射功率下制备出的薄膜成分及表面形貌的变化.得到了基底温度和溅射功率比值对成分及薄膜成岛方式的影响规律.实验表明:随着基底温度的升高,薄膜中岛的尺寸增加,数量减少;Ti靶与Ni靶材功率比值为3.7时,制备出的薄膜最接近等原子比. Radio frequency (RF) magnetron sputtering has been adopted as a new method for conducing research, aiming at solving the problem of how to control the number of Ni and Ti atoms during the preparation of NiTi alloy thin film. In this new preparation technology, we have chosen the pure Ni and Ti as the target materials, which are tilted and fixed and sputter simultaneously, at the same time the substrate rotates on its axis, This new technique can ensure the Ni and Ti atoms distributed evenly and control the ratio of the two atoms easily. The main objective of this paper is to investigate the rule of film atomic composition and surface morphology with different temperatures of the substrate and different sputtering powers at the initial stage of the film growth. The rule of substrate tempera- ture and sputtering power ratio influencing composition and island forming pattern of the film was obtained. The ex- periments show that as the substrate temperature increases, the size of the island increases and the amount decrea- ses. The two types of atoms can be near equal when the sputtering power ratio of Ni and Ti targets is 3.7.
出处 《哈尔滨工程大学学报》 EI CAS CSCD 北大核心 2013年第7期929-932,共4页 Journal of Harbin Engineering University
基金 中央高校基本科研业务费专项资金资助项目(DUT10LK42) 国家自然科学基金资助项目(11272072)
关键词 NITI合金 薄膜 基底 形貌 NiTi alloys thin film substrate morphology
  • 相关文献

参考文献12

  • 1刘二强,鲍明东,田林海,唐宾.元素成分对磁控溅射TiNi薄膜结构性能的影响及其控制[J].电镀与涂饰,2009,28(7):31-34. 被引量:3
  • 2MIYAZAKI S, FU Y Q, HUANG W M. Thin film shape memory alloys [ M ]. New York: Cambridge University Press, 2009 : 1-4.
  • 3KHALIL J A, REN X, EGGELER G. The mechanism of multistage martensitic transformations in aged Ni-rich NiTi shape memory alloys [ J ]. Aeta Materialia, 2002, 50 (4) : 793-803.
  • 4BENDAHAN M, CANET P, SEGUIN J L, et al. Control composition study of sputtered Ni-Ti shape memory alloy film [ J ]. Material Science and Engineering B, 1995, 34 (2/3) :112-115.
  • 5RUMPF H, WINZEK B, ZAMPONI C, et al. Sputter depo- sition of NiTi to investigate the Ti loss rate as a function of composition from cast melted targets [ J ]. Mater Sci Eng A,2004, 378(1/2):429-433.
  • 6RUMPF H, WALTHER T, ZAMPONI C, et al. High ulti- mate tensile stress in nano-grained superelastic NiTi thin films[ J]. Mater Sci Eng A, 2006, 415(1/2) :304-308.
  • 7SHIH C L, LAI B K, KAHN H, et al. A robust co-sputte- ring fabrication procedure for TiNi shape-memory alloys for MEMS[J]. J MEMS, 2001, 10(1):69-79.
  • 8SANJABI S, SADRNEZHAAD S K, YATES K A, et al. Growth and characterization of Tix Nii_x shape memory thin films using simultaneous sputter deposition from separate el- emental targets [ J ]. Thin Solid Films, 2005, 491 (1/2) : 190-196.
  • 9OHTA A, BHANSALI S, KISHIMOTO I, et al. Novel fab- rication technique of TiNi shape memory alloy film using separate Ti and Ni targets [ J ]. Sensors and Actuators A, 2000, 86(3) :165-170.
  • 10ZHU Yiguo, MAO Wen. Study on a new method to produce NiTi thin film [ J ]. Advanced Materials Research, 2012, 415-417 : 1899-1902.

二级参考文献49

  • 1胡作启.复合CrCO-Ti保护薄膜的热稳定性研究[J].真空电子技术,2007,20(4):87-90. 被引量:1
  • 2贺志荣,宫崎修一.Ni含量对TiNi形状记忆合金相变行为的影响[J].金属学报,1996,32(4):351-356. 被引量:22
  • 3宁智华,王治国,傅永庆,祖小涛.TiNi基形状记忆合金薄膜研究进展[J].材料导报,2006,20(2):118-120. 被引量:7
  • 4VINCENT J F V.Smart by name,smart by nature[J].Smart Materials & Structures,2000,9 (3):255-259.
  • 5KAHN H,HUFF M A,HEUER A H.The TiNi shape-memory alloy and its applications for MEMS[J].Journal of Micromechanics and Microengineering,1998,8 (3):213-221.
  • 6DUERIG T,PELTON A,STOCKEL D.An overview of nitinol medical applications[J].Materials Science and Engineering A,1999,273/275:149-160.
  • 7WOLF R H,HEUER A H.TiNi (shape memory) films on silicon for MEMS applications[J].Journal of Microelectromechanical Systems,1995,4(4):206-212.
  • 8FU Y Q,HUANG W M,DU H J,et al.Characterization of TiNi shape-memory alloy thin films for MEMS applications[J].Surface and Coatings Technology,2001,145 (1/3):107-112.
  • 9ISHIDA A,MARTYNOV V.Sputter-deposited shape-memory alloy thin films:properties and applications[J].MRS Bulletin,2002,27 (2):111-114.
  • 10CHEN P,TING J-M.Characteristics of TiNi alloy thin films[J].Thin Solid Films,2001,398/399:597-601.

共引文献8

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部