摘要
根据非接触式智能卡的结构,对智能卡中各个模块的可靠性进行分析,建立了非接触式智能卡的可靠性预计模型,对整个智能卡的最终稳定状态进行预估计算,在此基础上,开发了非接触式智能卡的可靠性预计软件,并简单介绍了软件的性能。
According to the structure of corttactless smart card, the reliability of each module of the smart card was analyzed. The reliability prediction model was established to estimate the final steady state of the entire smart card. The reliability prediction software for the contactless smart card was developed, and the performance of the software was introduced briefly.
出处
《半导体光电》
CAS
CSCD
北大核心
2013年第4期573-575,共3页
Semiconductor Optoelectronics
关键词
可靠性
可靠性预计
失效率
预计软件
reliability
reliability prediction
failure rate
prediction software