摘要
利用Hyperlynx软件对高速PCB板中所应用到的过孔进行建模与仿真,分析了过孔对流经其上信号的影响,并给出了改进、优化过孔的方法。仿真结果表明,在要求线上信号完整性高的情况下,使用过孔方式连接的电路得到了改善和优化。
High-speed PCB board vias modeling and simulation are made using Hyperlynx software to analyze the influence of the vias on the signals running through them, and an improved and optimized via hole method is proposed.Simulation results show that in the case of requirement of a high line signal integrity, circuits using via holes connec-tion are improved and optimized.
出处
《电子科技》
2013年第9期41-43,共3页
Electronic Science and Technology
