摘要
传统的MEMS系统级封装多采用IC标准的封装形式,例如塑料封装形式、陶瓷管壳封装形式、TO系列金属管壳封装。由于大过载传感器需要工作环境冲击振动比较高,陶瓷管壳容易破碎;塑封采用热塑成型,封装后残余应力大;TO系列管壳体积较大,并且采用直插形式安装,在超过5×103g冲击下,管脚容易折断。针对这种情况,本文提出了一种新型MEMS加速度计封装方法,在圆片级采用玻璃-硅-玻璃三层结构,并采用铝金属壳体螺钉安装并在壳体内部双组分环氧树脂灌封。封装之后的大过载加速度计具有体积小,密封性强,残余应力小、抗强冲击、稳定性好、适应于小批量生产等优点。
Standard IC （Integrated Circuit） package has been adopted in traditional system-level packaging of MEMS devices, such as plastic packages, shell packages of ceramic and shell packages of TO metal. Ceramic shell is easily broken due to the causes such as： the impact of high-g sensors is relatively high; large residual stress remains after thermoplastic encapsulation; shell of TO series is too large and pin is easily broken under the impact of more than 5 × 10^3g owing to the line installation. In response, this paper presents a new package method for MEMS aceelerometer, which adopts glass-silicon-glass structure at wafer level and introduces an aluminum shell filled with two-component epoxy resin at system level. There are many advantages of the aceelerometer after package, such as small volume, strong sealing, little residual stress, high-impact resistance, good stability, and suitable for small batch production, etc.
出处
《中国惯性技术学报》
EI
CSCD
北大核心
2013年第4期536-539,共4页
Journal of Chinese Inertial Technology
基金
国家自然基金(50905169)
