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TiAl与TC4扩散焊接接头的组织与性能 被引量:3

Structure and Joint Properties of Diffusion Bonded TiAl Alloy and TC4 Alloy
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摘要 主要对TiAl基金属间化合物与TC4的扩散连接技术进行了研究。通过对钛铝基合金进行热处理,获得了高温性能良好的全片层组织;通过对扩散连接后的接头进行组织结构、力学性能和断口的分析发现,在915℃/80 MPa/1 h的扩散连接条件下,TiAl基合金与TC4实现了冶金结合,在室温、400和500℃下,接头的抗拉强度分别达到了TiAl母材的91.77%、95.27%和99.21%。 TiA1 alloy was prepared using hot isostatic pressing process and the fully lamellar microstructure was achieved via heat treatment. Then the diffusion bonding of TiA1 and TC4 was invetigated. By the analysis of the microstructure, mechanical property and fracture surface, it is found that TiA1 alloy and TC4 alloy can be jointed well under the conditions of 915℃/80 MPafl h, and the joint achieves metallurgical combination. The joint part appears both TiA1 lamellar and TC4 rolling stripe. Strength of some joints exceeds the TiA1 substrate. At room temperature,400℃ and 500℃ ,the joint tensile strength reaches 91.77% ,95.27% and 99.21% of the TiA1 substrate ,respectively.
出处 《宇航材料工艺》 CAS CSCD 北大核心 2013年第3期77-80,共4页 Aerospace Materials & Technology
基金 教育部新世纪优秀人才支持计划(NCET-12-0849) 北京市教委产学研合作项目(GJ2012002) 国家重点基础研究发展计划(2011CB710706)
关键词 扩散连接 全片层组织 组织 性能 Diffusion bonding, Full lamellar microstructure, Microstructure,Property
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参考文献4

  • 1Zhang W J,Reddy B V,Deevi S C.Physical propertiesof TiAl-base alloys[J].Scripta Materialia,2001,45(6):645-651.
  • 2achara Y,Komizo Y,Langdon T G.Principles of superplasticdiffusion bonding[J].Materials Science and Technology,1988(4):669-674.
  • 3Chen W R,Triantafillou J,Beddoes J,et al.Effect offully lamellar morphology on creep of a near γ-TiAl intermetallic[J].Intermetallics,1999(7):171-178.
  • 4McCullough C,Valencia J J,Levi C G,et al.Phase equilibriaand solidification in Ti-Al alloys[J].Acta Metallurgica,1989,37(5):1321-1336.

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