摘要
在玻璃基体上通过喷雾热解覆盖一层ZnO薄膜 ,然后用AgNO3溶液活化、还原 ,最后化学镀铜 ,得到三层结构的镀件 ,适合作印刷电路板。
A newly developed process of electroless Cu plating of glass was introduced. The ZnO thin film was firstly prepared on glass substrate by pynolyzing and then activated by AgNO\-3. The Ag(0) could act as a catalyst in the process. The technology made it possible to prepare the copper layer with high adhession strength for printed circuit boards.
出处
《材料保护》
CAS
CSCD
北大核心
2000年第10期9-10,共2页
Materials Protection
