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Ar气氛下退火处理对6H-SiC晶片表面结构的影响 被引量:1

Effect of Annealing on the Surface Structure of 6H-SiC Wafer in Ar Atmosphere
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摘要 本文对物理气相传输法生长的三片2英寸掺氮6H-SiC晶片,分别在不同温度下进行退火处理。采用原子力显微镜(AFM)对SiC晶片表面结构进行表征,研究了不同温度和偏角度对SiC晶片表面结构的影响。发现Ar气氛下高温退火处理可以在晶片表面形成规则的台阶条纹,说明Ar气氛下的高温退火处理对SiC晶片表面有一定的刻蚀作用。 Three 2-inch N-doped 6H-SiC wafer grown by PVT method were annealed in different temperature.The surface morphology of SiC wafer characterized by Atom Force Microscope(AFM),and the influence of different temperature and the angle of inclination were studied.The results showed that regular steps formed on the surface of the SiC wafer after annealing,suggesting that high temperature annealing in Ar atmosphere had etching effect on the surface of SiC wafer.
出处 《人工晶体学报》 EI CAS CSCD 北大核心 2013年第5期865-868,共4页 Journal of Synthetic Crystals
基金 国家自然科学青年基金(51002176) 中国科学院知识创新工程重要方向项目(KJCX2-EW-W10) 江苏省产学联合技术创新基金项目(BY2011119) 国家高技术研究发展计划(863计划)(2013AA031603)
关键词 6H-SIC 退火 AFM 台阶结构 6H-SiC annealing AFM step structure
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参考文献9

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