摘要
通过阳极极化和电化学阻抗谱测试,研究了铜在磷酸溶液中进行电化学抛光的电化学行为。研究发现:随着磷酸浓度的增加,铜在0.2,0.4,0.6,0.8 V四个电位下电化学抛光后的粗糙度都呈现先减小、后增大的趋势,在磷酸质量分数为55%时达最低值;EIS图谱拟合的Rs值的变化反映了磷酸盐粘膜层电阻和铜表面氧化膜电阻的变化,此外,随着磷酸浓度的增加,EIS中第一个容抗半圆的弛豫时间延长,铜的溶解反应速度加快。
The eletrochemical properties of Cu eletrochemical polishing in phophoric acid solutions has been studied by anodic polarization and electrochemical impedance spectroscopy（EIS） technique.The roughness of Cu firstly decreased,and then increased with the concentration of H3PO4 increased at 0.2 V,0.4 V,0.6 V and 0.8 V,and reached the minimum roughness value when the H3PO4 concentration was 55%.The Rs value at different potential,fitting results of EIS,suggested the change in the resistance of viscous phosphate and Cu oxide films.With the increase of phosphate concentration,the relaxation time of the first capacitive semicircle extended,and it mean the acceleration in the copper dissolution reaction.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2013年第3期1-4,37,共5页
Surface Technology
基金
国家自然科学基金资助项目(50975058)
关键词
铜
磷酸
电化学抛光
粗糙度
电化学阻抗谱
copper
phosphoric acid
electrochemical polishing
roughness
electrochemical impedance spectroscopy
