摘要
阐述了铜基合金材料的性能及强化方法。采用电阻钎焊方式对铜基合金触头和紫铜接触板进行焊接,利用有限元分析软件对焊接过程进行温度场仿真模拟。模拟结果显示,焊接面温度从中心向四周由高到低分布,且大部分钎料均能熔化。从钎着率、焊缝组织及焊接结合强度3个方面对焊接质量进行测试。测试结果表明,焊接过渡层主要由固溶体组成,钎着率平均值为99.34%,剪切力平均值为1.24 kN,铜基合金触头焊接性能较好。
Performance and reinforcement method of copper base alloy materials were stated. The copper base alloy contact and contact panel were welded with resistance brazing. The temperature distribution of welding process was simulated by finite element analysis software. The results display that the temperature in the center of welding side distributes to all around from high to low, and most of solder is melted. The welding quality is measured by braze rate, weld microstructure and weld bonding strength. The test results show that the welding transition layer is mainly composed of solid solution phase, the average value of braze rate and shear force are 99.34% and 1.24 kN respectively, and the welding performance of copper alloy contact is better.
出处
《低压电器》
2013年第7期15-17,22,共4页
Low Voltage Apparatus
关键词
铜基合金
触头
焊接性能
有限元分析
copper base alloy
contact
welding performance
finite element analysis
