摘要
聚四氟乙烯(PTFE)因其材料本身之固有特性,在诸多加工工序面临技术瓶颈,尤其在"纯PTFE多层结构+台阶槽工艺"设计时表现尤为明显。主要针对PTFE台阶板在流程设计和层压控制技术方面进行了研究探讨,并通过同步蚀刻快速压合+控深铣槽揭盖工艺,有效解决了PTFE层压结合力差和台阶焊盘压合变形等业界常见的技术难题,极大提升了生产品质和效率。
Due to PTFE materials＇ inherent characteristics, it＇s facing many technical bottlenecks at manufacturing, especially reflected in the design process about ＇pure PTFE multilayer ＋ step groove＇. This paper discusses the PTFE step board＇s process design and laminating control technology. Through synchronous etching and quickly laminating plus lid removing process by depth milling control, it effectively solved the technical problems about low adhesion and pads deformation in lamination. The method greatly improved manufacturing＇s quality and efficiency.
出处
《印制电路信息》
2013年第5期80-82,共3页
Printed Circuit Information
关键词
聚四氟乙烯多层板
台阶槽设计
控深铣揭盖工艺
PTFE Multilayer Board
Design of Step Groove
Lid Removing Process by Milling with Depth Control
