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考虑低温蠕变的钎料本构及芯片可靠性评价 被引量：1

A Constitutive and Reliability Study on Solder Alloy Considering Low Temperature Creep
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摘要 金属材料及其合金的同系温度超过0.5时,蠕变成为材料变形的主导机理。钎料合金熔点较低,因而在极低温度下也可能发生蠕变变形。本文以Pb5Sn钎料为例,系统地测试了该钎料在-40℃～120℃范围内的蠕变特性,并提出了一套考虑更广温度、应力范围的钎料蠕变本构关系。数值仿真算例表明,在电子封装芯片可靠性评价中忽略钎料的低温蠕变可能导致结果的显著误差。 Creep deformation becomes a dominate deformation mode in metallic materials when the homologous temperature exceeds 0.5. A solder material normally has a low melting point, it can therefore creep at fairly low temperature. To uncover the creep characteristics, we systematically performed creep tests covering a broad temperature range （- 40℃ to 120℃） on Pb5Sn solder alloy. A new set of constitutive relations were derived to describe the comprehensive creep deformation considering broad stress and temperature ranges. A computational study rendered that, when evaluating creep failure, significant errors could be resulted from ignoring low temperature creep.
作者 张宇明 颜勇剑 翁琳 许金泉
机构地区 上海交通大学工程力学系
出处 《材料科学与工程学报》 CAS CSCD 北大核心 2013年第2期159-163,共5页 Journal of Materials Science and Engineering
关键词 钎料 蠕变 疲劳 本构关系 低温 solder creep fatigue constitutive relation low temperature
分类号 O344.6 [理学—固体力学]
  • 相关文献

参考文献12

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二级参考文献28

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共引文献17

同被引文献15

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引证文献1

二级引证文献11

材料科学与工程学报
2013年 第2期

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