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环氧基苯基硅树脂合成及其耐热性能研究 被引量:3

Synthesis and Heat-resistance Property of Silicone Resin Containing Epoxy and Phenyl Groups
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摘要 γ-环氧丙氧丙基三甲氧基硅烷(KH-560)和苯基甲氧基硅烷甲苯中以氢氧化钠为催化剂经水解-缩聚反应合成了环氧基苯基硅树脂,其化学结构由红外光谱和核磁共振得到了表征.研究了反应条件对该反应的影响以及对产物性能的影响.结果表明,当催化剂氢氧化钠的浓度为0.1%(质量分数),H2O/Si-OMe摩尔比为3,反应温度为60℃,反应时间为4~6h时,反应能够很好地进行,生成环氧基苯基硅树脂的产率可高达95%.热重分析(TG)表明,如此获得的环氧基苯基硅树脂具有较好的耐热性能,起始分解温度大于350℃,失重5%时的温度为405℃. The silicone resin containing epoxy and phenyl groups was synthesized by hydrolysis-polycondensation reaction of KH-560 as well as silanes containing phenyl and methoxy groups in toluene with NaOH aqueous solution as a catalyst, the structure of the product was characterized by IR and 1H-NMR. The paper researcheal on the influences of reaction parameters on the reaction and the properties of the product. The result show that the suitable reaction parameters are that the concentration of NaOH is 0.1 % (mass percent) , molar ratio of H20/Si-OMe is 3, reaction temperature is 60 ℃, reaction time is from 4 to 6 h. The TG analysis indicated that the resine obtained possessed good heat-resistance, i. e. ,it lost 5% weight at 405 ℃.
出处 《杭州师范大学学报(自然科学版)》 CAS 2013年第2期97-100,105,共5页 Journal of Hangzhou Normal University(Natural Science Edition)
基金 浙江省重点科技创新团队"有机硅创新团队"项目(2009R50016)
关键词 环氧基硅树脂 甲氧基硅烷 水解 合成 epoxy silicone resin silane containing methoxy group hydrolysis synthesis
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参考文献9

  • 1来国桥,幸松民.有机硅产品合成及应用[M].2版.北京:化学工业出版社,2010:690-693.
  • 2李美江,吴明军,吴艳金,胡自强,来国桥.聚甲基苯基硅氧烷改性双酚F环氧树脂及其粘接性能的研究[J].杭州师范大学学报(自然科学版),2012,11(2):118-121. 被引量:4
  • 3Yang Xin, Huang Wei, Yu Yunzhao. Synthesis, Characterization, and Properties of Silicone-Epoxy Resins[J]. Journal of Applied Polymer Science,2011(120):1216-1224.
  • 4Iroh J O, Rajamani D. Synthesis and Structure of Environmentally Friendly Hybrid Clay/ Organosilane Nanocomposite Coatings[J]. Journal of Inorgic Organometallic Polymers,2012(22):595-603.
  • 5蒋超杰,高俊刚,张学建.笼型倍半硅氧烷环氧树脂的合成与表征[J].热固性树脂,2007,22(1):5-8. 被引量:20
  • 6苏江勋,刘欢,郭莹,蔡华轮,许凯,陈鸣才.环氧基POSS/PAMAM杂合材料的制备及其性能[J].精细化工,2011,28(8):742-746. 被引量:9
  • 7Gao Nan, Liu Weiqu, Ma Songqi, et al. Modification of Epoxy Resin with Cycloaliphatic-Epoxy Oligosiloxane for Light Emitting Diode (LED) Encapsulation Application[J]. Journal of Macromolecular Science, Part B: Physics,2012(8).-1509-1524.
  • 8Saxena Kanak, Bisaria C S, Saxena A K. Studies on the synthesis and thermalproperties of alkoxysilane-terminated organosilicone dendrimers[J]. Appllied. Organometallic Chemistry,2010(24) :251-256.
  • 9佟哲.端环氧基硅油环氧值测定方法的探讨[J].有机硅材料,2012,26(4):258-261. 被引量:17

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