摘要
利用Arrhenius方程的老化动力学模型研究了环氧树脂基覆铜板的耐热老化性能。研究结果表明,固化体系、阻燃体系以及主体环氧树脂的结构直接影响覆铜板的耐老化性能。酚醛树脂固化体系覆铜板的耐热老化性优于双氰胺固化体系,磷系阻燃的覆铜板耐热老化性优于溴系阻燃体系,配方中添加具有刚性结构的环氧树脂有利于提高覆铜板的耐热老化性。
Thermal aging property of epoxy resin-based copper clad laminate（CCL）was investigated using the aging kinetics mode of Arrhenius equation.The results show that the curing system, the flame retardant system, and the structure of the main epoxy resin are the direct parameters that determining the thermal aging resistance of CCL.The heat aging resistance of phenolic（PN） curing system CCL is superior to the dicyandiamide（DICY） curing system, the heat aging resistance of the phosphorus-based flame retardant CCL is superior to the bromine flame retardant system, epoxy resin of rigid structure added in the formulation help to improve heat aging resistance of CCL.
出处
《工程塑料应用》
CAS
CSCD
北大核心
2013年第4期62-66,共5页
Engineering Plastics Application
关键词
环氧树脂
覆铜板
热老化
弯曲强度
电气强度
epoxy resin
copper clad laminate
themal aging
flexural strength
dielectric strength
