摘要
采用示差扫描量热法(DSC),在25～230℃范围内以不同的升温速率(5,10,15,20℃/min),研究了以聚醚胺/酚醛胺为固化剂的环氧树脂体系的固化行为,对其不同升温速率下的固化度进行了分析,采用T-β外推法得出了该体系的起始固化温度、峰顶固化温度和终止固化温度等固化工艺参数。
Curing behavior of polyether amine/phenolic amine-epoxy resin system was studied using DSC at heating rates ofS, 10, 15 and 20 ℃/min from 25 ℃ to 230 ℃, and the curing states were analyzed in different heating rates. At last, initial curing temperature, maximum curing temperature, and terminal curing temperature were calculated by extrapolating T-β.
出处
《包装工程》
CAS
CSCD
北大核心
2013年第7期7-9,33,共4页
Packaging Engineering
基金
国家自然科学基金委员会--中国工程物理研究院联合基金资助(U1230129)
关键词
环氧树脂
聚醚胺
酚醛胺
固化行为
差示扫描量热法
epoxy resin
polyether amine/phenolic amine
curing behavior
differential scanning calorimetry
