摘要
室温下对纯铜进行异步叠轧,制备超细晶铜材,研究了异步叠轧过程中纯铜显微组织演变、界面复合以及力学性能的变化。结果表明:搓轧区的存在促进了界面的复合和晶粒的细化;经六道次异步叠轧后可以使纯铜的平均晶粒尺寸从30μm减小到1μm,抗拉强度为450.3 MPa,屈服强度为346.5 MPa,轧制面显微硬度为108.5 HV,横截面显微硬度为66.3 HV,纵截面显微硬度为77.4 HV,伸长率为3%。
The ultra-fine-grained copper was prepared by asymmetrical accumulative rolling bonding（AARB） at room temperature. The microstructure evolution,layer interface binding and mechanical properties of pure copper were investigated during AARB. The results show that the existence of rubbed rolling area promotes the interface bonding and grain refinement. The grain size is successfully refined from 30μm to 1 μm, tensile strength and yield strength reaches 450. 3 MPa and 346. 5 MPa,respectively, microhardness of rolling plane, cross section and longitudinal section are 108.5 HV, 66.3 HV and 77.4 HV, and elongation is 3% for pure copper after AARB for six passes.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2013年第3期78-83,共6页
Transactions of Materials and Heat Treatment
基金
国家自然科学基金(50804018)
稀贵及有色金属先进材料教育部重点实验室开放基金(ZDS2010015C)
云南省科技条件平台建设项目(2010DH025)
关键词
铜
异步叠轧
微观组织
超细晶
力学性能
copper
asymmetrical accumulative rolling bonding（AARB）
microstructure
ultra-fine-grained
mechanical properties
