摘要
从3个方面论述了印制电路镀金技术的发展方向,即镀金溶液发生了急剧地变革;出现了性能优良的代金溶液;对脉冲、选择、激光等镀金方法作了展望。
The development tendency of printed circuit gold plating technique ,mainly on the three aspects,is in troduced. Emphases are given on the composition of bath solution,pulse plating and laser plating.
出处
《材料保护》
CAS
CSCD
北大核心
1991年第5期11-15,3,共5页
Materials Protection
