摘要
电子级的聚合物银浆料由于具有一定的导电性能和粘结性能,常与其它化学辅助试剂复合而做钽电容器的阴极引出材料使用。对该聚合物银浆在钽电解电容器的二氧化锰阴极层上被覆的工艺参数进行研究,讨论了不同银浆含量、不同固化温度、有无有机硅偶联剂等使用等条件对钽电解电容器电性参数的影响。实验结果表明,聚合物银浆的含量在95.5%左右及固化温度为200℃为聚合物银浆的最佳被覆工艺,特别是浸渍银浆之前在钽阳极块的阴极层表面浸渍有机硅偶联剂可以进一步改善钽电容器的电性能和可靠性,使等效串联电阻参数值得到较大的降低。
With its conductibility and stickiness, electric grade silver polymer slurry is often mixed with other chemical auxiliary reagents to produce tantalum capacitors. The paper discusses the parm eters in the process, focusing on the impact on the parameters by varying silver polymer slurry content, temperature, and presence of silicon coupling agent. With the analysis of experimental data, the results showed that the polymer paste the content of about 95.5% and curing temperature of 200 ℃ is the best coating process conditions for polymer silver paste. Especially the impregnation of coated silicone coupling agent on the cathode layer surface of tantalum anode before dipping silver slurry helps to improve the electrical performance and reliability of tantalum capacitors and reduce the ESR parameters.
出处
《陕西理工学院学报（自然科学版）》
2013年第1期42-46,51,共6页
Journal of Shananxi University of Technology:Natural Science Edition
关键词
钽电解电容器
聚合物银浆
固化温度
应用
tantalum capacitors
polymer silver pulp
curing temperature
application
