期刊文献+

太空环境下液体金属散热流道选型的数值模拟研究

Numerical Simulation on Channel Selection for Liquid Metal Cooling Device in Space Environment
原文传递
导出
摘要 本文设计了一极端工况,即在太空环境内有一热流密度为1[00 W/cm^2的发热器件。借助于三维数值模拟方法对液体金属不同流道的散热能力进行了评估。结果表明,该工况下,综合液体金属利用率及管道内流动阻力等因素,II型管道可实现较好的散热能力。进一步,文本设计了具有相同散热流道横截面积的"倒T"型流道,并进行流动方向的参数化研究,结果表明,"倒T"型流道内的分散交错流动可针对该极端工况实现良好的散热及均温能力. Evaluation on liquid metal heat dissipating heat flux 100 W/cm2 in space environment, was carried capacity in an extreme working condition, a out by 3D numerical simulation. As a result, channel II proposed in this paper is provided with an outstanding performance while taking various factors into the consideration. Furthermore, parametric studies were implemented on the "Inverted T" channel with same cross-section area channel took on a great heat dissipating working condition. Finally, scattered and reverse flow in such "Inverted T" and temperature equilibrium capacity for the extreme
出处 《工程热物理学报》 EI CAS CSCD 北大核心 2013年第2期348-351,共4页 Journal of Engineering Thermophysics
基金 国家自然科学基金资助项目(No.50977087)
关键词 液体金属 极端工况 流道选型 liquid metal cooling extreme working condition channel selection
  • 相关文献

参考文献2

二级参考文献10

  • 1李腾,刘静.芯片冷却技术中的微/纳米材料与结构的研究进展[J].微纳电子技术,2004,41(8):21-27. 被引量:10
  • 2李腾,刘静.芯片冷却技术的最新研究进展及其评价[J].制冷学报,2004,25(3):22-32. 被引量:69
  • 3刘静,周一欣.以低熔点金属或其合金作流动工质的芯片散热用散热装置[P].中国专利,02131419.5
  • 4李腾,吕永钢,刘静,周一欣.基于低熔点金属及其合金的计算机芯片散热方法[C].中国工程热物理学会2004年传热传质学会议,吉林,2004:1115-1118
  • 5J Liu, Y X Zhou, Y G Lv, and T Li. Liquid metal based miniaturized chip - cooling device driven by electromagnetic pump[ C]. 2005 ASME International Mechanical Engineering Congress & Exposition, 2005:5 - 11
  • 6T Li, Y G Lv, J Liu, and Y X Zhou. A powerful way of cooling computer chip using liquid metal as the cooling fluid[ M ]. Forschung im Ingenieurwesen Engineering Research, Published online :2006:8 - 26
  • 7Z S Deng, J Liu. Numerical evaluation on the heat dissipation capability of liquid metal based chip cooling device[ C ]. 12005 ASME International Mechanical Engineering Congress & Exposition :2005:5 - 11
  • 8J Liu. Development of new generation miniaturized chipcooling device using metal with low melting point or its alloy as the cooling fluid [ C ]. Proceedings of the International Conference on Micro Energy Systems, 2005:89 -97
  • 9G Uttam, C M Andrew. Cooling of electronics by electrically conducting fluids [ P]. United States Patent, 6,708,501,2004
  • 10安德鲁·卡尔·米勒,乌坦·高沙尔.散热装置及其热分散器[P].中国专利200410002780.X

共引文献17

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部