摘要
以双酚型液体环氧树脂作为基体环氧树脂,具有疏水性支链的芳香胺作为固化剂,疏水型熔融二氧化硅为填料,并配以触变剂、消泡剂、促进剂等助剂,通过DSC、TGA、TMA、回流焊等热分析手段以及高压蒸煮试验来对封装材料的性能进行表征,并对配方优化,获得了具有良好耐水性以及耐热性的单组分液体环氧树脂封装材料。结果表明:该封装材料具有良好的耐湿性和耐高温性能,可以满足COB(Chip on Board)封装客户对高压蒸煮及回流焊等可靠性测试的性能要求。
A single-component liquid thermostable and moisture-proof epoxy encapsulating material for using in COB（Chip on Board） assembly was prepared,in which Bis-phenol epoxy resin as basic material was compouded with a aromatic amine curing agent which contain modified hydrophobic branched chain,some hydrophobic fused silica filler,thixotropic agent,defoamer,and catalyst.The epoxy encapsulant was studied by DSC,TGA,TMA,reflow soldering and pressure cooker test.The results show that the properties of epoxy encapsulant prepared reach the demands of reliability test such as pressure cooker test and reflow soldering test.
出处
《电子与封装》
2012年第12期14-17,共4页
Electronics & Packaging
关键词
COB封装
耐湿性
耐高温
COB assembly
moisture-proof
thermostable
