摘要
本文以金刚石颗粒表面化学镀的方法镀覆镍金属层为背景,通过X射线衍射(XRD)、扫描电镜(SEM)等测试手段研究了pH值对镀层的组织、形貌及镀速的影响。结果表明:当镀液的pH值低于10.5时,镀速几乎为零,反应不能发生;pH值在10.5～12时,镀速随pH值的增加而增大,且镀速增加较快,XRD图谱中有镍峰存在,镍峰随pH值的增加而增强,基体有裸露现象;当pH值在13左右时,镀速较为稳定,镍衍射峰较强,镀层较为均匀,无裸露现象;pH值接近14时,镀层较为粗糙,且有脱落现象。在pH值等于13的条件下二次化学镀,基体表面得到的镀层厚度大约为1.5μm,镀层致密度较好,且包覆严实。
Nickel metal layer was plated on the surface of diamond particles by chemical plating method is the background of this paper.The structure,microstructure and plating rate were changed by the pH vale of plating bath,which was investigated through XRD and SEM analysis.The results show that the plating rate almost was zero and no reaction can occur when the pH below 10.5.When the pH value was between 10.5 and 12,the plating rate increating with the increased of the pH vale,the plating rate was increased faster,the Ni peaks in X-ray diffraction patterns of plating was found,the peak intensity enhancing with the increased of the pH value and the substrate was not covered of Ni plating completely.The plating rate remained steady when the pH value was about 13,the Ni peaks in X-ray diffraction patterns of powders was more strong,the substrate was coating of Ni plating completely,the plating was dense and uniformity.The plating had an exfoliation phenomenon and relatively roughness until the pH value closed to 14.The double-plating was be carry out under the conditions of the pH 13,the plating thickness was about 1.5 μm,the coating was more dense and closely.
出处
《人工晶体学报》
EI
CAS
CSCD
北大核心
2012年第6期1629-1633,共5页
Journal of Synthetic Crystals
基金
河南科技大学青年科学研究基金(2007QN0007)
关键词
化学镀
金刚石
镍镀层
chemical plating
diamond
Ni coating layer
