摘要
本文介绍了硅片的几何参数:直径、厚度、平整度、粗糙度、弯曲度、翘曲度等的含义和测试原理及方法。
This article introduces the principle and method for testing ,the meaning of geometric parameters of silicon wafers such as diameter, thickness, flatness, roughness, bow and warp.
出处
《现代制造技术与装备》
2012年第6期42-43,57,共3页
Modern Manufacturing Technology and Equipment
关键词
硅片
几何参数
测试
silicon wafer, geometric parameters, test and mea- surement
