期刊文献+

硅探测器加工中的离子注入工艺设计与控制 被引量:1

Design and Control of Ion Implantation in the Fabrication of Silicon Detectors
原文传递
导出
摘要 应用离子注入工艺可制备获得线性电流大、窗口死层薄的硅pin辐射探测器。首先简要介绍了离子注入工艺形成pn结的原理,重点根据技术要求进行了离子注入工艺设计和计算,分别得到了注入能量为40 keV和注入剂量为4×1014/cm2的两个重要控制参数。同时分析了在离子注入工艺中存在的影响因素和相应处理方法,对生产具有良好的指导作用。采用所设计的工艺参数制备获得的硅pin辐射探测器各项技术指标均满足要求,验证了离子注入工艺设计与参数控制的有效性。 The ion implantation can be used for the fabrication of silicon pin radiation detectors with thin sensitive window and large linear current. The principle of the pn junction formed by the ion implantation was introduced briefly. According to the technical requirements, the ion im- plantation process was designed and calculated. And the two important control parameters, the implantation energy of 40 keV and the implantation dose of 4 X 1014/cm2 , were obtained respec- tively. Meanwhile, the influence factors and corresponding methods were analyzed, which gives a good guide for the production. The silicon pin radiation detector was fabricated using the de- signed process parameters. And the each technical index could meet the requirement. The validi- ties of the process design and parameter control for ion implantation were verified.
出处 《微纳电子技术》 CAS 北大核心 2012年第12期824-828,共5页 Micronanoelectronic Technology
关键词 离子注入 硅pin辐射探测器 PN结 注入能量 注入剂量 死层 ion implantation silicon pin radiation detector pn junction implantation energy^implantation dose dead layer
  • 相关文献

参考文献12

  • 1AK1MOV Y K. Silicon radiation detectors [J]. Instruments and Experimental Techniques, 2007, 50 (1) 1 - 28.
  • 2HAGIWARA O, WATANBE M, SAT() E, et al. Energy discrimination X-ray computed tomography system utilizing a silicon pin detector and its application to 2.0-keV-width K- edge imaging [J]. Nuclear Instruments and Methods in Phy sicsResearch= A, 2011, 638 (1): 165-170.
  • 3SZIKI G, DOBOS E, KERTESZ Z, et al. A pin detector array {or the determination of boron using nuclear reaction analysis at a nuclear microprobe [J]. Nuclear Instruments and Me- thods in Physics Research: B, 2004, 219/2201 420- 424.
  • 4LI Z, KRANER H W. Fast neutron radiation damage effects on high resistivity silicon junction detectors [J]. Journal of Electronic Materials, 1992, 21 (7) : 701 - 705.
  • 5王小兵,谭继廉,张金霞,卢子伟,鲍志勤,李存璠,王柱生,凤莹,许金兰,朱光武,王世金,梁金宝,沈思忠,高萍.半导体探测器及其在空间科学中的应用[J].核电子学与探测技术,2001,21(5):377-379. 被引量:4
  • 6施伟红,陈鸿飞,邹鸿,邹积清,田大宇,宁宝俊,张录.PIN型辐射探测器的并联使用[J].核电子学与探测技术,2007,27(5):908-910. 被引量:3
  • 7ZHOU C Z, WARBORTON W K. Comparison of silicon pin diode detector fabrication processes using ion implantation and thermal doping [J]. Instruments and Methods in Physics Re- search A, 1996, 378 (3): 529-530.
  • 8郭洪生,何锡钧,彭太平.大面积PIN探测器性能参数实验测量[J].原子核物理评论,2005,22(3):272-275. 被引量:3
  • 9JAROSZEWICS B, BUDZYNSKI T, PANAS A, et al. High quality p-n junction fabrication by ion implantation using the LPCVD amorphous silicon film [J]. Vacuum, 2003, 70 (2): 81-85.
  • 10施敏,梅凯瑞.半导体制造工艺基础[M].合肥:安徽大学出版社,2007.

二级参考文献7

共引文献11

同被引文献7

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部