摘要
讲述了印制线路板电镀填盲孔带闪镀和不闪镀的工艺流程及其对设备的要求,讨论了影响电镀填盲孔效果的因素,包括设备设计、电镀参数、板材、孔型、镀液组成等。
The process flows with and without flash plating for blind via filling of printed circuit board and related equipment requirements were introduced. The factors affecting blind via filling were discussed, such as equipment design, electroplating parameters, board material, via configuration, and bath comoosition.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2012年第12期33-37,共5页
Electroplating & Finishing
关键词
印制线路板
盲孔
填孔
电镀
设备
工艺条件
printed circuit board
blind via
filling
electroplating
equipment
process parameter
