摘要
以硝酸银为活化剂、葡萄糖为还原剂，对玻璃纤维化学镀银工艺进行正交优化，并研究了施镀时间对镀层电阻率的影响，得到最佳化学镀银工艺为：AgN036g／L，C6H12068g／L，NH3。H20100mL／L，C2HsOH100mL／L，NaOH4g／L，K10．5～1．0mg／L，温度30℃，时间25min。结果表明，随施镀时间延长，镀银玻璃纤维的电阻率先减小后增大。在最佳工艺下制得的镀银玻璃纤维表面均匀、有光泽，结合力及导电性良好，厚度可达12μm。
The process for electroless silver plating on glass fiber was optimized by orthogonal test using AgN03 as activator and glucose as reducing agent. The effect of plating time on the resistivity of coating was studied. The optimal process parameters for electroless silver plating were determined as follows： AgNO3 6 g/L, C6H1206 8 g/L, NH3＂H20 100 mL/L, C2H5OH 100 mL/L, NaOH 4 g/L, KI 0.5-1.0 mg/L, temperature 30 ℃, and time 25 min. The results show that the resistivity of silver-coated glass fiber is decreased initially and then increased as the plating time prolongs. The silver-coated glass fiber prepared under the optimal process conditions has uniform and lustrous surface, excellent adhesion and conductivity, and a thickness of 12 μm.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2012年第12期25-27,共3页
Electroplating & Finishing
关键词
玻璃纤维
化学银镀
导电性
正交试验
glass fiber
electroless silver plating
conductivity
orthogonal test
