摘要
介绍了一种基于BiCMOS工艺的恒温晶振专用集成电路芯片。该芯片集成了分立式恒温晶振的大部分有源和无源器件,包括稳压、振荡、控温和输出缓冲等单元电路。稳压、振荡等对相位噪声影响较大的电路其关键部分采用双极工艺器件设计;控温、输出缓冲等电路采用CMOS工艺器件设计;二者结合降低相位噪声的同时减少了芯片版图面积。稳压电路引入了动态补偿网络,以增强电路稳定性;振荡电路采用科尔匹兹并联振荡电路,该电路所需器件少且工作稳定,利于集成。实测结果表明,用该芯片结合10 MHz SC切晶体谐振器研制的恒温晶振样品相位噪声达到-103 dBc/Hz@1 Hz,-128 dBc/Hz@10 Hz,-142 dBc/Hz@100 Hz,-151 dBc/Hz@1 kHz;频率-温度稳定性在-55～+70℃范围内优于±2×10-8。
An ASIC chip for oven control crystal oscillator （OCXO） based on BiCMOS technology is proposed. Majority of active and passive devices of the OCXO were integrated in the ASIC, including LDO circuit, oscillation circuit, oven control circuit and the output buffer circuit. The key parts of circuit which contribute much more noise, such as LDO circuit, oscillation circuit, were designed with bipolar devices. While the oven control circuit and output buffer ciruit were designed with CMOS devices. Consequently, the phase noise is reduced and the area of the whole chip is minimized. The dynamic compensation network was introduced to improve the stability of LDO circuit. Colpitts oscillation circuit requires few devices and works well, which is suitable for integration. The measurement results show that the phase noise of the OCXO ASIC with 10 MHz SC cut crystal resonantor is - 103 dBc/Hz@ 1 Hz, - 128 dBc/Hz@ 10 Hz, - 142 dBc/Hz@ 100 Hz, - 151 dBc/Hz@ 1 kHz and the frequency- temperature stability is better than ±2 × 10^-8 from -55 ℃ to 70 ℃.
出处
《半导体技术》
CAS
CSCD
北大核心
2012年第11期832-835,共4页
Semiconductor Technology
关键词
恒温晶振(OCXO)
专用集成电路(ASIC)
相位噪声
频率-温度稳定性
晶体谐振器
oven control crystal oscillator （OCXO）
application specific integrated circuit （ASIC）
phase noise
temperature-frequency stability
crystal resonator
