摘要
在印制电路板制造中,孔内铜瘤是电镀制程中最常见的问题之一,其存在会严重影响产品的可靠性。由于造成孔内铜瘤的原因很多,且具有一定的隐蔽性,要彻底改善此类问题是一件是分棘手的事情。本文将以典型类孔内铜瘤的形成原因进行分析,并结合实际改善经验提出相应的改善对策,从而达到有效改善此类问题之目的,并为业界技术工作者改善同类问题提供一定的参考。
In printed circuit board manufacturing,the copper nodule in through hole is one of the most common in plating process,and with a certain degree of concealment,its existence will seriously affect reliability of products.Because of the resulting copper nodule in through hole for many reasons,and with a certain degree of concealment,ti is a troublesome thing to thoroughly improve sich problems.This paper will be analyses the formation cause of copper nodule,and actual improve experience puts forward the corresponding improvement the purpose of such problems,and for the industry works improve the similar problem to provide certain reference.
出处
《印制电路信息》
2012年第11期24-27,36,共5页
Printed Circuit Information
关键词
PCB
铜瘤
毛刺
维护
PCB
Copper Nodule
Burr
Maintenance
