摘要
应用热分析技术,能够在产品设计阶段获得其温度分布,从而优化设计,提高产品的可靠性,延长其使用寿命。该文以19吋2U电子产品的热设计为例,介绍了用Ansys软件的热分析功能进行辅助热分析的数值方法和热分析软件的特点,通过仿真分析,预测产品内部的热量分布和气流分布情况,并把仿真结果与实验值进行了比较,验证了方法的正确性。根据分析结果优化相应的设计参数,合理调整设计布局,可以找到最佳的设计方案。阐述了Ansys仿真技术的特点和一般应用方法。
Application of thermal analysis technology to the product design stage to obtain the temperature distribution,in order to optimize design and improve the reliability of new products,extending its life.In this paper,take the design of 19 inches 2U electronic products for example,describes the thermal analysis using Ansys software supporting functions of numerical methods of thermal analysis and thermal analysis software features,forecasting new product within the distribution of heat distribution and airflow by using simulation analysis and the simulation results are compared with experiments to verify the correctness of the method.Based on the results corresponding to optimize the design parameters,a reasonable adjustment design layout,you can find the best design.And described the general characteristics and application methods about Ansys simulation.
出处
《舰船电子工程》
2012年第10期146-148,共3页
Ship Electronic Engineering
关键词
电子设备
热设计
仿真分析
可靠性
electronic equipment
thermal design
simulation analysis
reliability
