摘要
以聚丙烯(PP)为基体,以单一碳化硅晶须(SiCw)、碳化硅颗粒(SiCp)和混杂SiCw/SiCp为导热填料,共混/模压制备PP基导热复合材料。结果表明:同等用量下,混杂SiCw/SiCp填充PP具有比单一SiCw或SiCp填充PP更佳的导热性能,且随SiCw/SiCp用量的增加而增加;当SiCw/SiCp质量分数为50%时,导热性能最佳,其导热系数为0.856 W/(m.K),为纯PP的5倍多。PP的拉伸强度与冲击强度随SiCw/SiCp用量的增加先增加后降低,当混杂SiCw/SiCp质量分数为10%时,力学性能最佳。相比SiCp而言,SiCw更易在PP中形成导热网链。
Polypropylene （PP） matrix thermal conductivity composites were prepared by mixing/mould pressing method with PP as an resin matrix, single silicon carbide whisker （SiCw） ＆silicon carbide particle （SiCp） and hybrid SiCw/SiCp pas the thermal conductive fillers. Results showed that the thermal conductivity increased with the increasing content of thermal conductive fillers SiCw/SiCp. The thermal conductivity of the PP composites filled with hybrid SiCw/SiCp possessed better thermal conductivity than that of the composites filled with single SiCw or SiCp. The thermal conductivity coefficient k was 0. 856 W/（ m · K） with 50 wt% hybrid SiCw/SiCp, about 5 times higher than that of the neat PP. Both the tensile and impact strength of the composites increased firstly, but decreased with excessive addition of SiCw/SiCp. The mechanical properties were optimal with 10 wt% hybrid SiCw/SiCp. The SiCw was much easier to form the thermal conductivity chains and network than that of SiCp.
出处
《塑料工业》
CAS
CSCD
北大核心
2012年第10期92-94,共3页
China Plastics Industry
关键词
聚丙烯
碳化硅
导热复合材料
模型拟合
PP
Silicon Carbide
Thermal Conductivity Composites
Model Fitting
