摘要
在Sn-0.7Cu-0.3Ni焊料的基础上,掺加不同比例的Ag元素,形成(Sn-0.7Cu-0.3Ni)-xAg系合金,研究不同的Ag掺量对Sn-0.7Cu-0.3Ni的熔化温度、润湿性及焊接接头微观组织的影响。结果表明,随Ag掺量的增加,能够降低其熔点,但这个体系的熔点普遍较高;随Ag掺量的增加,体系的润湿性能变好,但不明显;随Ag掺量的增加,界面化合物层的厚度逐渐增大,起伏逐渐变小而呈平坦的连续相。
（Sn-0.7Cu-0.3Ni）-xAg alloy was formed by adding Ag element in Sn-0.7Cu-0.3Ni solder. The Sn- 0.7Cu-0.3Ni solder alloy was investigated by different addition of Ag element. The effects of Ag ineulsion on melt tempreture, wetting property and microstmcture of the welded joint were studied. The results show that： the melting point is depressed when Ag content is added. But the melting point of this system is higher generally; the wettability increases when Ag content is added, but not obvious; with the increase of Ag content, the thickness of IMC increases gradually, up and down, which becomes smaller and generates a flat continuous phase.
出处
《热加工工艺》
CSCD
北大核心
2012年第19期176-177,179,共3页
Hot Working Technology
基金
南京信息职业技术学院院级资助课题(YKJ10-019)
