摘要
在镀液中添加铁氧体粒子制备Ni-Fe基磁性复合镀层是电沉积技术一个新的发展方向,目前相关研究不多。采用电沉积法在铜片上制备了Ni-Fe-NiFe2O4复合镀层,用电化学方法、金相显微镜及能谱仪研究了镀液中NiFe2O4含量、电流密度、表面活性剂十六烷基三甲基溴化铵(CTAB)等对复合镀层性能的影响。结果表明:复合镀层硬度随镀液中NiFe2O4含量的增加先增大后减小,含量为15 g/L时镀层硬度达370 HV,耐蚀性最好;随电流密度增大,沉积速率加快,镀层显微硬度增加,耐蚀性略有提高;加入CTAB能提高镀层中微粒的复合量,可在较低的电流密度下获得孔隙小、致密度高的镀层,显微硬度也有所提高,但耐蚀性略有下降;在温度为60℃,镀液中NiFe2O4含量为15 g/L,电流密度为5 A/dm2,CTAB含量为0.1%(质量分数)时,可获得性能较好的复合镀层,镀层中NiFe2O4含量较高,均匀致密,微观表面粗糙,无裂纹,与基体结合良好。
Ni-Fe-NiFe2O4 composite coatings were prepared on copper plate substrate by electrodeposition.The effects of concentration of NiFe2O4 particle in plating bath,current density and surfactant cetyltrimethyl ammonium bromide(CTAB) on the properties of as-plated composite coatings were investigated with an electrochemical test rig as well as a scanning electron microscope and an energy dispersive spectrometer.Results indicate that the hardness of Ni-Fe-NiFe2O4 composite coatings initially rises but then declines with increasing content of NiFe2O2 in the plating bath.The composite coating obtained from the plating bath containing 15 g/L NiFe2O4 has a hardness of 370 HV and shows the best corrosion resistance.Both the deposition rate and microhardness of the composite coatings rise with increasing current density,while the corrosion resistance slightly rises therewith.Besides,introducing surfactant CTAB helps to increase the content of NiFe2O4 particulates in as-plated composite coatings,allowing formation of composite coatings with small pores and high hardness as well as increased microhardness at a relatively low current density,though the corrosion resistance is slightly decreased by the introduction of the surfactant.Moreover,the composite coating obtained from the plating bath containing 15 g/L NiFe2O4 and 0.1% CTAB(mass fraction) at a temperature of 60 ℃ and current density of 5 A/dm2 is uniform,compact,and free of surface crack,and has good comprehensive properties as well as good adhesion to Cu substrate.
出处
《材料保护》
CAS
CSCD
北大核心
2012年第8期33-36,71-72,共4页
Materials Protection
