摘要
应用分子动力学中嵌入原子法(EAM)势函数模拟纳米单晶铜的拉伸过程,得出具有完整结构和各种缺陷结构模型拉伸时的强度极限应力,并分析了缺陷对模型拉伸强度的影响.结果表明:孔洞会降低纳米金属材料拉伸强度,表面缺陷是降低纳米金属材料拉伸强度的最主要因素,不同大小的空穴对纳米金属材料拉伸强度有不同的影响.
Using the embedded atom method （EAM） potential function in the molecular dynamics,the tensile process of nano single-crystal copper was simulated. Then the ultimate tensile strength were calculated for both no defect and defects models, and impacts of defects on ultimate strength were analyzed. The results show that hole defect can reduce the tensile strength of nanoscopic metal material, surface defect is the most important factor of reducing the strength, and cavities in different sizes have different effects on tensile strength of nanoscopic metal material.
出处
《上海工程技术大学学报》
CAS
2012年第2期101-104,110,共5页
Journal of Shanghai University of Engineering Science
基金
教育部春晖计划资助项目(Z2009-1-01031)
关键词
分子动力学
纳米单晶铜
缺陷
molecular dynamics
nano single-crystal copper
defect
