摘要
用热膨胀仪和闪光导热仪研究了温度对HMX基PBX的热膨胀系数和热导率的影响。结果表明,在低于330K时,HMX基PBX的线膨胀系数约为5.34×10-5 K-1;在330～350K,线膨胀系数迅速增大到13.47×10-5K-1,随着黏结剂软化,线膨胀系数随之减小到8.04×10-5 K-1。在293～373K,HMX基PBX的比热容从0.978J.g-1.K-1线性增长到1.254J.g-1.K-1,但在343K附近黏结剂融化存在异常偏大值;HMX基PBX的热扩散率从0.256mm2.s-1下降至0.179mm2.s-1,通过比热和热扩散率实验数据计算获得的热导率从0.462W.m-1.K-1下降至0.406W.m-1.K-1。基于分子晶体传热理论模型建立了比热和导热系数的温度关系函数,HMX基PBX的导热机制符合两相串联模型。
The effect of temperature on thermal expansion and thermal conductivity of the HMX based polymer bonded explosive （PBX） were investigated by a thermal expansion analyzer and a flash thermal conductivity analyzer. The results show that coefficient of thermal expansion of HMX based PBX is about 5.34×10-5K 1 below 330K, which rapidly reachs to 13.47×10 -5 K -1 at temperature ranging from 330K to 350K, and decreases to 8. 04×10-5K-1 above 350K. The specific heat capacity increases monotonically as temperature increasing, which ranging from 0. 978J . g-1 . K 1 to 1. 254J. g -1 . K 1 between 293K and 373K. But it is abnormal big at temperature about 343K as a result of the molten of the binder. The thermal diffusivity is 0. 256mm2.s-1 at 293K and decreases to 0. 179mm2.s-1 at 373K. The thermal conductivity is 0. 462W .m-1.K-1 at 293K, decreasing to 0. 406W .m-1.K 1 at 373K. The thermal conductivity and specific heat capaety variation with the temperature are established based on heat transfer theory of molecular crystal, and the thermal conductivities of HMX based PBX calculated from the two-phase vertical system model are in good agreement with the experiment.
出处
《火炸药学报》
EI
CAS
CSCD
北大核心
2012年第3期33-37,41,共6页
Chinese Journal of Explosives & Propellants
基金
化工材料研究所创新基金(626010947)
关键词
物理化学
高聚物黏结炸药
线膨胀系数
比热
导热系数
physical chemistry
polymer bonded explosive
coefficient of thermal expansion
specific heat
thermal conductivity
