摘要
高厚径比小孔通孔电镀是PCB电镀铜的重要环节。文章将介绍一种在普通高酸低铜电镀液中加入一种吡咯与咪唑的含氮杂环聚合物的通孔电镀铜添加剂,经过通孔电镀和CVS实验结果,证明该电镀液对厚度与孔径比达到10:1的小孔(Φ=0.25 mm)的通孔电镀能力达到百分之八十五以上,具有很好的实用价值。
High Aspect Ratio through-hole plating is one of the important PCB process. This article introduces an ordinary high acid and low copper electroplating solution in a pyrrole and imidazole nitrogencontaining heterocyclic polymer through-hole plating copper additives. After a through-hole plating and CVS experiment, the results prove that the plating solution can improve the capacity more than 85% on the thickness and the aperture ratio of 10：1 holes （f= 0.25mm）, which has practical value.
出处
《印制电路信息》
2012年第7期21-24,共4页
Printed Circuit Information
关键词
通孔
高厚径比
微切片
伏安曲线
Through Hole High thickness to diameter ratio micro-slice Voltammetric curves
